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半导体翘曲测试技术新的标杆

    热翘曲,变形,应变和CTE(热膨胀系数)测量。

    在美国设计;,在台湾装配的Apex的研究和分析:DIC表面特征跟踪, 用于确定变形,应变和表面轮廓,3D翘曲显示。


    晶圆、IC 芯片、线路板的热翘曲和热膨胀系数测量系统:

当温度上升或下降时,材料分别膨胀或收缩,量化给定材料的热膨胀/收缩量,我们的α系列系统测量任何IC芯片、晶圆或电路板等材料。

APEX-RESEARCHa-30

Key Features:

  • Benefit for DIC: CSI DIC Inside 

  • Turn-Key Solution: Warpage、 CTE and Strain Measurement 

  • Uniform Temperature by Convection, Ramp Rate: Up to 3°C 

  • Temperature Range: -40°C ~260°C Specimen Size Range: 2mm~600mm Resolution: ~2um (in plane) 

  • Projection Pattern (Warpage Testing) Automatic Calibration 

  • Automatic Report Generation 

  • JEDEC Standard JESD22-B112 

  • Easy Setup 


Wafer, IC Chip and Board thermal warpage and CTE measurement systems 

Coefficient of Thermal Expansion (CTE) Ma terials expand or cont ract when temperature rises or fall , res pectively. Quantifies the amount of this ther mal expansion /contraction for a given material. 

Our Alpha-series system measures CTE of any material such as IC chip, wafer or board. 

  • Window dimensions : 600mm x 600 mm or 400mm x 400mm. 

  • Temperature up to 260 degree C. 

  • For isotropic or anisotropic materials CTE Report: auto generation or custom designed 


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