热翘曲和热膨胀系数测量系统

Water, IC Chip and Board thermal warpage and CTE measurement systems.
晶圆、IC芯片、线路板的热翘曲和热膨胀系数测量系统

Coefficient of Thermal Expansion (CTE) Materials expand or contract when temperature rises or fall, respectively. Quantifies the amount of this thermal expansion / contraction for a given material.
热膨胀系数（CTE）材料分别在温度升高或降低时膨胀或收缩。量化给定材料的热膨胀/收缩量。




Our Alpha-series system measures CTE of any material such as IC ship, water or board.
我们的Alpha系列系统测量任何材料的CTE，如IC船、水或板。

• Window dimensions: 600 mm × 600 mm or 400 mm × 400 mm.

• Temperature up to 260 degree C.

• For isotropic or anisotropic materials.

• CTE Report: auto generation or custom designed.

• Benefit for DIC: CSI DIC Inside

• Turn-Key Solution: Warpage、CTE and Strain Measurement

• Uniform Temperature by Convection, Ramp Rate: Up to 3℃

• Temperature Range: -40℃~260℃

• Specimen Size Range: 2 mm ~ 600 mm

• Resolution: ~2 um (in lpane)

• Projection Pattern (Warpage Testing)

• Automatic Calibration

• Automatic Report Generation

• JEDEC Standard JESD22-B112

• Easy Setup